Sharp interface model of creep deformation in crystalline solids

Y. Mishin, G. B. McFadden, R. F. Sekerka, and W. J. Boettinger
Phys. Rev. B 92, 064113 – Published 24 August 2015

Abstract

We present a rigorous irreversible thermodynamics treatment of creep deformation of solid materials with interfaces described as geometric surfaces capable of vacancy generation and absorption and moving under the influence of local thermodynamic forces. The free energy dissipation rate derived in this work permits clear identification of thermodynamic driving forces for all stages of the creep process and formulation of kinetic equations of creep deformation and microstructure evolution. The theory incorporates capillary effects and reveals the different roles played by the interface free energy and interface stress. To describe the interaction of grain boundaries with stresses, we classify grain boundaries into coherent, incoherent and semicoherent, depending on their mechanical response to the stress. To prepare for future applications, we specialize the general equations to a particular case of a linear-elastic solid with a small concentration of vacancies. The proposed theory creates a thermodynamic framework for addressing more complex cases, such as creep in multicomponent alloys and cross-effects among vacancy generation/absorption and grain boundary motion and sliding.

  • Received 21 April 2015

DOI:https://doi.org/10.1103/PhysRevB.92.064113

©2015 American Physical Society

Authors & Affiliations

Y. Mishin1, G. B. McFadden2, R. F. Sekerka3, and W. J. Boettinger4

  • 1Department of Physics and Astronomy, MSN 3F3, George Mason University, Fairfax, Virginia 22030, USA
  • 2Information Technology Laboratory, National Institute of Standards and Technology, Gaithersburg, Maryland 20899, USA
  • 3Department of Physics, Carnegie Mellon University, Pittsburgh, Pennsylvania 15213, USA
  • 4Materials Science and Engineering Division, National Institute of Standards and Technology, Gaithersburg, Maryland 20899, USA

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Issue

Vol. 92, Iss. 6 — 1 August 2015

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