Spin Hall effect by surface roughness

Lingjun Zhou, Vahram L. Grigoryan, Sadamichi Maekawa, Xuhui Wang, and Jiang Xiao (萧江)
Phys. Rev. B 91, 045407 – Published 8 January 2015

Abstract

The spin Hall and its inverse effects, driven by the spin orbit interaction, provide an interconversion mechanism between spin and charge currents. Since the spin Hall effect generates and manipulates spin current electrically, to achieve a large effect is becoming an important topic in both academia and industries. So far, materials with heavy elements carrying a strong spin orbit interaction, provide the only option. We propose here a new mechanism, using the surface roughness in ultrathin films, to enhance the spin Hall effect without heavy elements. Our analysis based on Cu and Al thin films suggests that surface roughness is capable of driving a spin Hall angle that is comparable to that in bulk Au. We also demonstrate that the spin Hall effect induced by surface roughness subscribes only to the side-jump contribution but not the skew scattering. The paradigm proposed in this paper provides the second, not if only, alternative to generate a sizable spin Hall effect.

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  • Received 11 July 2014
  • Revised 15 November 2014

DOI:https://doi.org/10.1103/PhysRevB.91.045407

©2015 American Physical Society

Authors & Affiliations

Lingjun Zhou1, Vahram L. Grigoryan1, Sadamichi Maekawa2,3, Xuhui Wang4,*, and Jiang Xiao (萧江)1,5,†

  • 1Department of Physics and State Key Laboratory of Surface Physics, Fudan University, Shanghai 200433, China
  • 2Advanced Science Research Center, Japan Atomic Energy Agency, Tokai 319-1195, Japan
  • 3CREST, Japan Science and Technology Agency, Tokyo 102-0075, Japan
  • 4King Abdullah University of Science and Technology (KAUST), Physical Science and Engineering Division, Thuwal 23955-6900, Saudi Arabia
  • 5Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, 210093, China

  • *Corresponding author: xuhui.wang@kaust.edu.sa
  • Corresponding author: xiaojiang@fudan.edu.cn

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Issue

Vol. 91, Iss. 4 — 15 January 2015

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