Carrier screening, transport, and relaxation in three-dimensional Dirac semimetals

S. Das Sarma, E. H. Hwang, and Hongki Min
Phys. Rev. B 91, 035201 – Published 15 January 2015

Abstract

A theory is developed for the density and temperature-dependent carrier conductivity in doped three-dimensional (3D) Dirac materials focusing on resistive scattering from screened Coulomb disorder due to random charged impurities (e.g., dopant ions and unintentional background impurities). The theory applies both in the undoped intrinsic (“high-temperature,” TTF) and the doped extrinsic (“low-temperature,” TTF) limit with analytical scaling properties for the carrier conductivity obtained in both regimes, where TF is the Fermi temperature corresponding to the doped free carrier density (electrons or holes). The scaling properties describing how the conductivity depends on the density and temperature can be used to establish the Dirac nature of 3D systems through transport measurements. We also consider the temperature-dependent conductivity limited by the acoustic phonon scattering in 3D Dirac materials. In addition, we theoretically calculate and compare the single-particle relaxation time τs, defining the quantum level broadening, and the transport scattering time τt, defining the conductivity, in the presence of screened charged impurity scattering. A critical quantitative analysis of the τt/τs results for 3D Dirac materials in the presence of long-range screened Coulomb disorder is provided.

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  • Received 10 August 2014
  • Revised 2 December 2014

DOI:https://doi.org/10.1103/PhysRevB.91.035201

©2015 American Physical Society

Authors & Affiliations

S. Das Sarma1, E. H. Hwang1,2, and Hongki Min1,3

  • 1Condensed Matter Theory Center, Department of Physics, University of Maryland, College Park, Maryland 20742-4111, USA
  • 2SKKU Advanced Institute of Nanotechnology and Department of Physics, Sungkyunkwan University, Suwon 440-746, Korea
  • 3Department of Physics and Astronomy, Seoul National University, Seoul 151-747, Korea

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Issue

Vol. 91, Iss. 3 — 15 January 2015

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