Thermal interfacial transport in the presence of ballistic heat modes

Bjorn Vermeersch, Amr M. S. Mohammed, Gilles Pernot, Yee Rui Koh, and Ali Shakouri
Phys. Rev. B 90, 014306 – Published 25 July 2014
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Abstract

Thermal interface (Kapitza) resistance expresses how hard it is for heat to flow across material junctions inside multilayer structures. This quantity plays a crucial role in the thermal performance of nanoscale devices but is still poorly understood. Here we show that conventional Fourier-based metrology overestimates metal/semiconductor resistances by up to threefold due to misinterpretation of ballistic heat flow modes. We achieve improved identification and a different physical insight with a truncated Lévy formalism. This approach properly distinguishes interfacial dynamics from nearby quasiballistic heat flow suppression in the semiconductor. Unlike conventionally extracted values, interface resistances obtained with our new approach are independent of laser modulation frequency, as physically appropriate, and much more closely approach theoretical predictions.

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  • Received 2 February 2014
  • Revised 8 July 2014

DOI:https://doi.org/10.1103/PhysRevB.90.014306

©2014 American Physical Society

Authors & Affiliations

Bjorn Vermeersch1,*, Amr M. S. Mohammed1,†, Gilles Pernot2, Yee Rui Koh1, and Ali Shakouri1,‡

  • 1Birck Nanotechnology Center, Purdue University, West Lafayette, Indiana 47907, USA
  • 2LOMA, Université de Bordeaux 1, 33400 Talence, France

  • *These authors contributed equally to this work: bvermeer@purdue.edu
  • These authors contributed equally to this work: amrmoham@purdue.edu
  • shakouri@purdue.edu

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Issue

Vol. 90, Iss. 1 — 1 July 2014

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