Observation of Coulomb repulsion between Cu intercalants in CuxBi2Se3

Chris Mann, Damien West, Ireneusz Miotkowski, Yong P. Chen, Shengbai Zhang, and Chih-Kang Shih
Phys. Rev. B 89, 155312 – Published 17 April 2014
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Abstract

Using scanning tunneling microscopy and ab initio simulations, we have identified several configurations for Cu dopants in CuxBi2Se3, with Cu intercalants being the most abundant. Through statistical analysis, we show strong short-range repulsive interactions between Cu intercalants. At intermediate range (>5 nm), the pair distribution function shows oscillatory structure along the 101¯ directions, which appear to be influenced by different diffusion barriers along the 101¯ and 21¯1¯ directions.

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  • Received 29 October 2013
  • Revised 1 April 2014

DOI:https://doi.org/10.1103/PhysRevB.89.155312

©2014 American Physical Society

Authors & Affiliations

Chris Mann1, Damien West2, Ireneusz Miotkowski3, Yong P. Chen3,4, Shengbai Zhang2, and Chih-Kang Shih1,5,*

  • 1Materials Science & Engineering, University of Texas at Austin, Austin, Texas 78712, USA
  • 2Department of Physics, Applied Physics, and Astronomy, Rensselaer Polytechnic Institute, Troy, New York 12180, USA
  • 3Department of Physics, Purdue University, 525 Northwestern Ave., West Lafayette, Indiana 47907, USA
  • 4Birck Nanotechnology Center and School of Electrical and Computer Engineering, Purdue University, West Lafayette, Indiana 47907, USA
  • 5Department of Physics, University of Texas at Austin, Austin, Texas 78712, USA

  • *Corresponding author: shih@physics.utexas.edu

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Issue

Vol. 89, Iss. 15 — 15 April 2014

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