High-resolution projection image reconstruction of thick objects by hard x-ray diffraction microscopy

Yukio Takahashi, Yoshinori Nishino, Ryosuke Tsutsumi, Nobuyuki Zettsu, Eiichiro Matsubara, Kazuto Yamauchi, and Tetsuya Ishikawa
Phys. Rev. B 82, 214102 – Published 2 December 2010

Abstract

Hard x-ray diffraction microscopy enables us to observe thick objects at high spatial resolution. The resolution of this method is limited, in principle, by only the x-ray wavelength and the largest scattering angle recorded. As the resolution approaches the wavelength, the thickness effect of objects plays a significant role in x-ray diffraction microscopy. In this paper, we report high-resolution hard x-ray diffraction microscopy for thick objects. We used highly focused coherent x rays with a wavelength of 0.1nm as an incident beam and measured the diffraction patterns of a 150-nm-thick silver nanocube at the scattering angle of 3°. We observed a characteristic contrast of the coherent diffraction pattern due to only the thickness effect and collected the diffraction patterns at nine incident angles so as to obtain information on a cross section of Fourier space. We reconstructed a pure projection image by the iterative phasing method from the patched diffraction pattern. The edge resolution of the reconstructed image was 2nm, which was the highest resolution so far achieved by x-ray microscopy. The present study provides us with a method for quantitatively observing thick samples at high resolution by hard x-ray diffraction microscopy.

    • Received 15 October 2010

    DOI:https://doi.org/10.1103/PhysRevB.82.214102

    ©2010 American Physical Society

    Authors & Affiliations

    Yukio Takahashi1,*, Yoshinori Nishino2, Ryosuke Tsutsumi3, Nobuyuki Zettsu4, Eiichiro Matsubara5, Kazuto Yamauchi3,4, and Tetsuya Ishikawa6

    • 1Frontier Research Base for Global Young Researchers, Frontier Research Center, Graduate School of Engineering, Osaka University, 2-1 Yamada-oka, Suita, Osaka 565-0871, Japan
    • 2Research Institute for Electronic Science, Hokkaido University, Sapporo 001-0021, Japan
    • 3Department of Precision Science and Technology, Graduate School of Engineering, Osaka University, 2-1 Yamada-oka, Suita, Osaka 565-0871, Japan
    • 4Research Center for Ultra-precision Science and Technology, Graduate School of Engineering, Osaka University, 2-1 Yamada-oka, Suita, Osaka 565-0871, Japan
    • 5Department of Materials Science and Engineering, Kyoto University, Yoshida, Sakyo, Kyoto 606-8501, Japan
    • 6RIKEN SPring-8 Center, Kouto, Sayo-cho, Sayo-gun, Hyogo 679-5148, Japan

    • *Corresponding author; takahashi@wakate.frc.eng.osaka-u.ac.jp

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    Issue

    Vol. 82, Iss. 21 — 1 December 2010

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