Molecular dynamics simulation of thermal boundary conductance between carbon nanotubes and SiO2

Zhun-Yong Ong and Eric Pop
Phys. Rev. B 81, 155408 – Published 5 April 2010

Abstract

We investigate thermal energy coupling between carbon nanotubes (CNTs) and SiO2 with nonequilibrium molecular dynamics simulations. The phonon thermal boundary conductance (g) per CNT unit length is found to scale proportionally with the strength of the van der Waals interaction (χ), with CNT diameter (D), and as power law of temperature (T1/3 between 200 and 600 K). The thermal relaxation time of a single CNT on SiO2 is independent of diameter, τ85ps. With the standard set of parameters g0.1WK1m1 for a 1.7 nm diameter CNT at room temperature. Our results are comparable to, and explain the range of experimental values for CNT-SiO2 thermal coupling from variations in diameter, temperature, or details of the surface interaction strength.

  • Figure
  • Figure
  • Figure
  • Figure
  • Figure
  • Figure
  • Received 14 October 2009

DOI:https://doi.org/10.1103/PhysRevB.81.155408

©2010 American Physical Society

Authors & Affiliations

Zhun-Yong Ong1,2 and Eric Pop1,3,4,*

  • 1Micro and Nanotechnology Laboratory, University of Illinois at Urbana–Champaign, Urbana, Illinois 61801, USA
  • 2Department of Physics, University of Illinois at Urbana–Champaign, Urbana, Illinois 61801, USA
  • 3Department of Electrical & Computer Engineering, University of Illinois at Urbana–Champaign, Urbana, Illinois 61801, USA
  • 4Beckman Institute, University of Illinois at Urbana–Champaign, Urbana, Illinois 61801, USA

  • *epop@illinois.edu

Article Text (Subscription Required)

Click to Expand

References (Subscription Required)

Click to Expand
Issue

Vol. 81, Iss. 15 — 15 April 2010

Reuse & Permissions
Access Options
Author publication services for translation and copyediting assistance advertisement

Authorization Required


×
×

Images

×

Sign up to receive regular email alerts from Physical Review B

Log In

Cancel
×

Search


Article Lookup

Paste a citation or DOI

Enter a citation
×