Surface structure of liquid Bi and Sn: An x-ray reflectivity study

P. S. Pershan, S. E. Stoltz, Oleg G. Shpyrko, Moshe Deutsch, Venkatachalapathy S. K. Balagurusamy, Mati Meron, Binhua Lin, and Reinhard Streitel
Phys. Rev. B 79, 115417 – Published 13 March 2009

Abstract

X-ray reflectivity measurements of the liquid Bi surface are presented and analyzed together with previous liquid Sn results. Published measurements on liquid Ga, In, and K all exhibit a single strong maximum at a wave-vector transfer of the order of the reciprocal of an atomic-diameter, due to surface-induced layering. In contrast, both Sn and Bi exhibit—in addition—a weak broad peak at much smaller wave-vector transfers. This feature is an unambiguous signature of an enhanced electron density in the near-surface region. Possible ways of modeling this enhancement are presented. Once the different surface-roughening effects of thermal capillary waves are accounted for, the surface structure factors of Sn and Bi are remarkably similar. The principal difference between the two is that the depth of the layering below the surface is more than 40% larger for Bi than for Sn. This is considerably larger than the ratio of their covalent radii which is only 10%. No theoretical explanation can be offered at this time for the surface structure difference between Sn and Bi and other elemental liquid metals studied to date: Ga, In, and K.

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  • Received 10 November 2008

DOI:https://doi.org/10.1103/PhysRevB.79.115417

©2009 American Physical Society

Authors & Affiliations

P. S. Pershan1, S. E. Stoltz1, Oleg G. Shpyrko2, Moshe Deutsch3, Venkatachalapathy S. K. Balagurusamy1, Mati Meron4, Binhua Lin4, and Reinhard Streitel1

  • 1Department of Physics and SEAS, Harvard University, Cambridge, Massachusetts 02138, USA
  • 2Department of Physics, University of California–San Diego, San Diego, La Jolla, California 92093, USA
  • 3Department of Physics and Institute of Nanotechnology and Advanced Materials, Bar-Ilan University, Ramat-Gan 52900, Israel
  • 4CARS, University of Chicago, Chicago, Illinois 60637, USA

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Issue

Vol. 79, Iss. 11 — 15 March 2009

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