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Temperature-dependent pseudogap in the oxypnictides LaFeAsO1xFx and LaFePO1xFx seen via angle-integrated photoemission

Y. Ishida, T. Shimojima, K. Ishizaka, T. Kiss, M. Okawa, T. Togashi, S. Watanabe, X.-Y. Wang, C.-T. Chen, Y. Kamihara, M. Hirano, H. Hosono, and S. Shin
Phys. Rev. B 79, 060503(R) – Published 4 February 2009

Abstract

We have performed a temperature-dependent angle-integrated laser photoemission study of iron oxypnictide superconductors LaFeAsO:F and LaFePO:F exhibiting critical-transition temperatures (Tc’s) of 26 and 5 K, respectively. We find that high-Tc LaFeAsO:F exhibits a temperature-dependent pseudogaplike feature extending over 0.1eV about the Fermi level at 250 K, whereas such a feature is absent in low-Tc LaFePO:F. We also find 20-meV pseudogaplike features and signatures of superconducting gaps in both LaFeAsO:F and LaFePO:F. We discuss the possible origins of the unusual pseudogaplike features through comparison with the high-Tc cuprates.

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  • Received 15 December 2008

DOI:https://doi.org/10.1103/PhysRevB.79.060503

©2009 American Physical Society

Authors & Affiliations

Y. Ishida1, T. Shimojima2, K. Ishizaka2,3, T. Kiss2, M. Okawa2, T. Togashi1, S. Watanabe2, X.-Y. Wang4, C.-T. Chen4, Y. Kamihara5,6, M. Hirano5,7, H. Hosono5,6,7, and S. Shin1,2,3

  • 1RIKEN SPring-8 Center, Sayo, Sayo, Hyogo 679-5148, Japan
  • 2ISSP, University of Tokyo, Kashiwa-no-ha, Kashiwa, Chiba 277-8561, Japan
  • 3CREST, Japan Science and Technology Agency, Tokyo 102-0075, Japan
  • 4Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Zhongguancun, Beijing 100080, China
  • 5ERATO-SORST, JST, Frontier Research Center, Tokyo Institute of Technology, Mail Box S2-13, 4259 Nagatsuta, Midori-ku, Yokohama 226-8503, Japan
  • 6Frontier Research Center, Tokyo Institute of Technology, Mail Box R3-1, 4259 Nagatsuta, Midori-ku, Yokohama 226-8503, Japan
  • 7Materials and Structures Laboratory, Tokyo Institute of Technology, Mail Box R3-1, 4259 Nagatsuta, Midori-ku, Yokohama 226-8503, Japan

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Issue

Vol. 79, Iss. 6 — 1 February 2009

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