Ab initio calculations of the mechanical and electronic properties of strained Si nanowires

Paul W. Leu, Alexei Svizhenko, and Kyeongjae Cho
Phys. Rev. B 77, 235305 – Published 9 June 2008

Abstract

This paper reports a systematic study of the mechanical and electronic properties of strained small diameter (0.7–2.6 nm) silicon nanowires (Si NWs) using ab initio density functional theory calculations. The values of Young’s modulus, Poisson ratio, band gap, effective mass, work function, and deformation potentials are calculated for 110 and 111 Si NWs. We find that quantum confinement in 110 Si NWs splits conduction band valleys and decreases transport effective mass compared to the bulk case. Consequently, additional tensile strain should not lead to further significant electron mobility improvement. An interesting finding we report in this paper is that under compressive strain, there is a dramatic decrease in deformation potentials of 110 Si NWs, which may result in a strong increase in electron mobilities, despite a concurrent increase in effective mass. We also observe a similar strain-induced counterplay of hole deformation potentials and effective masses for both 110 and 111 Si NWs. Finally, we do not see any significant effect of tensile or compressive strain on electron effective masses and deformation potentials in 111 Si NWs. The sudden changes in effective mass and deformation potentials are concurrent with a change in the conduction and valence band edge states. In 110 NWs, this change corresponds to a transition from direct-to-indirect band gap under strain.

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  • Received 5 September 2007

DOI:https://doi.org/10.1103/PhysRevB.77.235305

©2008 American Physical Society

Authors & Affiliations

Paul W. Leu*, Alexei Svizhenko, and Kyeongjae Cho

  • Stanford University, Stanford, California 94305, USA

  • *pleu@stanford.edu
  • Also at Silvaco Data Systems, Inc., Santa Clara, CA 95054; alexeis@silvaco.com
  • Also at University of Texas at Dallas, Richardson, TX 75083; kyeongjae.cho@utdallas.edu

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Issue

Vol. 77, Iss. 23 — 15 June 2008

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