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Fast diffusion mechanism of silicon tri-interstitial defects

Yaojun A. Du, Stephen A. Barr, Kaden R. A. Hazzard, Thomas J. Lenosky, Richard G. Hennig, and John W. Wilkins
Phys. Rev. B 72, 241306(R) – Published 15 December 2005

Abstract

Molecular dynamics combined with the nudged elastic band method reveals the microscopic self-diffusion process of compact silicon tri-interstitials. Tight-binding molecular dynamics paired with ab initio density functional calculations speed the identification of diffusion mechanisms. The diffusion pathway can be visualized as a five defect-atom object both translating and rotating in a screwlike motion along ⟨111⟩ directions. The density functional theory yields a diffusion constant of 4×105exp(0.49eVkBT)cm2s. The low diffusion barrier of the compact tri-interstitial may be important in the growth of ion-implantation-induced extended interstitial defects.

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  • Received 12 April 2005

DOI:https://doi.org/10.1103/PhysRevB.72.241306

©2005 American Physical Society

Authors & Affiliations

Yaojun A. Du1, Stephen A. Barr2, Kaden R. A. Hazzard3, Thomas J. Lenosky1, Richard G. Hennig1, and John W. Wilkins1

  • 1Department of Physics, Ohio State University, Columbus, Ohio, USA
  • 2Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois, USA
  • 3Department of Physics, Cornell University, Ithaca, New York, USA

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Issue

Vol. 72, Iss. 24 — 15 December 2005

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