Influence of Y2BaCuO5 particles on the microstructure of YBa2Cu3O7x (123)-Y2BaCuO5 (211) melt-textured superconductors

Pavel Diko, Wolfgang Gawalek, Tobias Habisreuther, Thomas Klupsch, and Peter Görnert
Phys. Rev. B 52, 13658 – Published 1 November 1995
PDFExport Citation

Abstract

The paper is devoted to the microstructural defects in melt-processed YBaCuO which can be active either as magnetic-flux-pinning centers or weak links. The influence of 211 particles in 123-211 melt-textured bulk superconductors on the microstructural features such as microcracking, subgrains, twins, and twin complexes was studied by polarized light microscopy. The observed linear dependence between a-b microcrack spacing, and lc, and d211V123/V211 (d211 means 211 particle size, V123 means 123 volume fraction, V211 means 211 volume fraction) proves that the microcracking process can be described under the framework of a model devised for the multiple failure of a unidirectional composite under uniaxial tensile loading. Shorter mean-free distance between 211 particles depresses the subgrain thickness, the twin complex size, and twin spacing. The level of residual tensile stress in the 123 a-b plane was estimated from detwinning observed around 211 particles.

  • Received 30 June 1995

DOI:https://doi.org/10.1103/PhysRevB.52.13658

©1995 American Physical Society

Authors & Affiliations

Pavel Diko

  • Institute of Experimental Physics, Slovak Academy of Sciences, Watsonova 47, 04353 Kosice, Slovakia

Wolfgang Gawalek, Tobias Habisreuther, Thomas Klupsch, and Peter Görnert

  • Institut für Physikalische Hochtechnologie, Helmholtzweg 4, 100239 Jena, D-07702, Germany

References (Subscription Required)

Click to Expand
Issue

Vol. 52, Iss. 18 — 1 November 1995

Reuse & Permissions
Access Options
Author publication services for translation and copyediting assistance advertisement

Authorization Required


×
×

Images

×

Sign up to receive regular email alerts from Physical Review B

Log In

Cancel
×

Search


Article Lookup

Paste a citation or DOI

Enter a citation
×