Surface-stress effects on elastic properties. I. Thin metal films

F. H. Streitz, R. C. Cammarata, and K. Sieradzki
Phys. Rev. B 49, 10699 – Published 15 April 1994
PDFExport Citation

Abstract

We present a detailed model describing the effects of surface stress on the equilibrium spacing and biaxial modulus of thin metal films. The model predicts that very thin films will equilibrate to a spacing in the plane substantially smaller than the bulk spacing for the material, and that this biaxial strain will vanish as the reciprocal of the film thickness. The model predicts enhancements in the biaxial modulus of thin metal films which also scale with the reciprocal of the film thickness. The magnitude of both the strain and the resulting change in biaxial modulus are proportional to the magnitude of the surface stress. We verified the predictions of the surface-stress model by performing molecular-dynamics computer simulations of thin metal films using an analytic form of the embedded-atom-method potential. The model was found to predict accurately the equilibrium properties of thin metal films.

  • Received 8 April 1993

DOI:https://doi.org/10.1103/PhysRevB.49.10699

©1994 American Physical Society

Authors & Affiliations

F. H. Streitz

  • Department of Physics and Astronomy, The Johns Hopkins University, Baltimore, Maryland 21218

R. C. Cammarata and K. Sieradzki

  • Department of Materials Science and Engineering, The Johns Hopkins University, Baltimore, Maryland 21218

See Also

Surface-stress effects on elastic properties. II. Metallic multilayers

F. H. Streitz, R. C. Cammarata, and K. Sieradzki
Phys. Rev. B 49, 10707 (1994)

References (Subscription Required)

Click to Expand
Issue

Vol. 49, Iss. 15 — 15 April 1994

Reuse & Permissions
Access Options
Author publication services for translation and copyediting assistance advertisement

Authorization Required


×
×

Images

×

Sign up to receive regular email alerts from Physical Review B

Log In

Cancel
×

Search


Article Lookup

Paste a citation or DOI

Enter a citation
×