Weak effects of electron-phonon interactions on the lattice thermal conductivity of wurtzite GaN with high electron concentrations

Jianshi Sun, Shouhang Li, Zhen Tong, Cheng Shao, Xiangchuan Chen, Qianqian Liu, Yucheng Xiong, Meng An, and Xiangjun Liu
Phys. Rev. B 109, 134308 – Published 24 April 2024

Abstract

Wurtzite gallium nitride (GaN) has great potential for high-frequency and high-power applications due to its excellent electrical and thermal transport properties. However, enhancing the performance of GaN-based power electronics relies on heavy doping. Previous studies showed that electron-phonon interactions have strong effects on the lattice thermal conductivity of GaN due to the Fröhlich interaction. Surprisingly, our investigation reveals weak effects of electron-phonon interactions on the lattice thermal conductivity of n-type GaN at ultrahigh electron concentrations and the impact of the Fröhlich interaction can be ignored. The small phonon-electron scattering rate is attributed to the limited scattering channels, quantified by the Fermi surface nesting function. In contrast, there is a significant reduction in the lattice thermal conductivity of p-type GaN at high hole concentrations due to the relatively larger Fermi surface nesting function. Meanwhile, as p-type GaN has relatively smaller electron-phonon matrix elements, the reduction in lattice thermal conductivity is still weaker than that observed in p-type silicon. Our work provides a deep understanding of thermal transport in doped GaN and the conclusions can be further extended to other wide-band-gap semiconductors, including βGa2O3, AlN, and ZnO.

  • Figure
  • Figure
  • Figure
  • Figure
  • Received 18 January 2024
  • Accepted 25 March 2024

DOI:https://doi.org/10.1103/PhysRevB.109.134308

©2024 American Physical Society

Physics Subject Headings (PhySH)

Atomic, Molecular & OpticalCondensed Matter, Materials & Applied Physics

Authors & Affiliations

Jianshi Sun1, Shouhang Li1,*, Zhen Tong2, Cheng Shao3, Xiangchuan Chen1, Qianqian Liu1, Yucheng Xiong1, Meng An4, and Xiangjun Liu1,†

  • 1Institute of Micro/Nano Electromechanical System and Integrated Circuit, College of Mechanical Engineering, Donghua University, Shanghai 201620, China
  • 2School of Advanced Energy, Sun Yat-Sen University, Shenzhen 518107, China
  • 3Thermal Science Research Center, Shandong Institute of Advanced Technology, Jinan, Shandong 250103, China
  • 4Department of Mechanical Engineering, University of Tokyo, 7-3-1 Hongo, Bunkyo, Tokyo 113-8656, Japan

  • *shouhang.li@dhu.edu.cn
  • xjliu@dhu.edu.cn

Article Text (Subscription Required)

Click to Expand

Supplemental Material (Subscription Required)

Click to Expand

References (Subscription Required)

Click to Expand
Issue

Vol. 109, Iss. 13 — 1 April 2024

Reuse & Permissions
Access Options
Author publication services for translation and copyediting assistance advertisement

Authorization Required


×
×

Images

×

Sign up to receive regular email alerts from Physical Review B

Log In

Cancel
×

Search


Article Lookup

Paste a citation or DOI

Enter a citation
×