Ta4SiTe4: A possible one-dimensional topological insulator

Siyuan Liu, Huabing Yin, David J. Singh, and Peng-Fei Liu
Phys. Rev. B 105, 195419 – Published 16 May 2022

Abstract

Using the first-principles calculations, we present a prediction of the nontrivial topological phase in one-dimensional (1D) Ta4SiTe4 with high stability further verified by the molecular dynamics simulation and phonon spectrum. In this material, the band inversion intrinsically occurs between Tad and Tep orbitals without the spin-orbit coupling effect. As a novel topological insulator, protected by time-reversal symmetry and inversion symmetry , we explicitly demonstrate the existence of nontrivial topological invariants and the protected edge states in it with a large bulk band gap of 163meV, which could facilitate the experimental verification at the room temperature. In addition, we find its topological states are robust against the external pressure. Our results uncover a potential 1D topological-insulating Ta4SiTe4 and promote it as a concrete material platform for exploring the intriguing physics of low-dimensional topological phases.

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  • Received 13 January 2022
  • Revised 10 April 2022
  • Accepted 6 May 2022

DOI:https://doi.org/10.1103/PhysRevB.105.195419

©2022 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied Physics

Authors & Affiliations

Siyuan Liu1, Huabing Yin1,*, David J. Singh2,3, and Peng-Fei Liu4,5,†

  • 1Institute for Computational Materials Science, International Joint Research Laboratory of New Energy Materials and Devices of Henan Province, School of Physics and Electronics, Henan University, Kaifeng 475004, China
  • 2Department of Physics and Astronomy, University of Missouri, Columbia, Missouri 65211, USA
  • 3Department of Chemistry, University of Missouri, Columbia, Missouri 65211, USA
  • 4Institute of High Energy Physics, Chinese Academy of Sciences, Beijing 100049, China
  • 5Spallation Neutron Source Science Center, Dongguan 523803, China

  • *yhb@henu.edu.cn
  • pfliu@ihep.ac.cn

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Issue

Vol. 105, Iss. 19 — 15 May 2022

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