Self-correcting quantum memory in a thermal environment

Stefano Chesi, Beat Röthlisberger, and Daniel Loss
Phys. Rev. A 82, 022305 – Published 6 August 2010

Abstract

The ability to store information is of fundamental importance to any computer, be it classical or quantum. To identify systems for quantum memories, which rely, analogously to classical memories, on passive error protection (“self-correction”), is of greatest interest in quantum information science. While systems with topological ground states have been considered to be promising candidates, a large class of them was recently proven unstable against thermal fluctuations. Here, we propose two-dimensional (2D) spin models unaffected by this result. Specifically, we introduce repulsive long-range interactions in the toric code and establish a memory lifetime polynomially increasing with the system size. This remarkable stability is shown to originate directly from the repulsive long-range nature of the interactions. We study the time dynamics of the quantum memory in terms of diffusing anyons and support our analytical results with extensive numerical simulations. Our findings demonstrate that self-correcting quantum memories can exist in 2D at finite temperatures.

  • Figure
  • Figure
  • Figure
  • Figure
  • Figure
  • Figure
  • Figure
2 More
  • Received 19 April 2010

DOI:https://doi.org/10.1103/PhysRevA.82.022305

©2010 American Physical Society

Authors & Affiliations

Stefano Chesi, Beat Röthlisberger, and Daniel Loss

  • Department of Physics, University of Basel, Klingelbergstrasse 82, CH-4056 Basel, Switzerland

Article Text (Subscription Required)

Click to Expand

References (Subscription Required)

Click to Expand
Issue

Vol. 82, Iss. 2 — August 2010

Reuse & Permissions
Access Options
Author publication services for translation and copyediting assistance advertisement

Authorization Required


×
×

Images

×

Sign up to receive regular email alerts from Physical Review A

Log In

Cancel
×

Search


Article Lookup

Paste a citation or DOI

Enter a citation
×