Distributed quantum algorithm for Simon's problem

Jiawei Tan, Ligang Xiao, Daowen Qiu, Le Luo, and Paulo Mateus
Phys. Rev. A 106, 032417 – Published 13 September 2022

Abstract

Limited by today's physical devices, quantum circuits with a long depth are usually noisy and difficult to realize in practice. The novel computing architecture of distributed quantum computing is expected to reduce the noise and depth of quantum circuits. In this paper, we study Simon's problem in distributed scenarios and design a distributed quantum algorithm to solve the problem. The algorithm proposed by us has the advantage of exponential acceleration compared with classical distributed computing and has the advantage of square acceleration compared with the best distributed quantum algorithm proposed before in query complexity. In particular, the previous distributed quantum algorithm for Simon's problem cannot be extended to the case of more than two computing nodes (i.e., two subproblems), but our distributed quantum algorithm can be extended to the case of multiple computing nodes (i.e., multiple subproblems).

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  • Received 5 May 2022
  • Revised 19 August 2022
  • Accepted 31 August 2022

DOI:https://doi.org/10.1103/PhysRevA.106.032417

©2022 American Physical Society

Physics Subject Headings (PhySH)

Quantum Information, Science & Technology

Authors & Affiliations

Jiawei Tan*, Ligang Xiao, and Daowen Qiu

  • Institute of Quantum Computing and Computer Theory, School of Computer Science and Engineering, Sun Yat-sen University, Guangzhou 510006, China; The Guangdong Key Laboratory of Information Security Technology, Sun Yat-sen University, 510006, China; and QUDOOR Technologies Inc., Guangzhou, China

Le Luo

  • School of Physics and Astronomy, Sun Yat-sen University, Zhuhai 519082, China and QUDOOR Technologies Inc., Guangzhou, China

Paulo Mateus

  • Instituto de Telecomunicações, Departamento de Matemática, Instituto Superior Técnico, Avenida Rovisco Pais, 1049-001 Lisbon, Portugal

  • *912574652@qq.com
  • Corresponding author: issqdw@mail.sysu.edu.cn

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Issue

Vol. 106, Iss. 3 — September 2022

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