Pseudomorphic Growth of a Single Element Quasiperiodic Ultrathin Film on a Quasicrystal Substrate

J. Ledieu, J. T. Hoeft, D. E. Reid, J. A. Smerdon, R. D. Diehl, T. A. Lograsso, A. R. Ross, and R. McGrath
Phys. Rev. Lett. 92, 135507 – Published 2 April 2004

Abstract

An ultrathin film with a periodic interlayer spacing was grown by the deposition of Cu atoms on the fivefold surface of the icosahedral Al70Pd21Mn9 quasicrystal. For coverages from 5 to 25 monolayers, a distinctive quasiperiodic low-energy electron diffraction pattern is observed. Scanning tunneling microscopy images show that the in-plane structure comprises rows having separations of S=4.5±0.2Å and L=7.3±0.3Å, whose ratio equals τ=1.618 within experimental error. The sequences of such row separations form segments of terms of the Fibonacci sequence, indicative of the formation of a pseudomorphic Cu film.

  • Figure
  • Figure
  • Figure
  • Received 1 October 2003

DOI:https://doi.org/10.1103/PhysRevLett.92.135507

©2004 American Physical Society

Authors & Affiliations

J. Ledieu, J. T. Hoeft, D. E. Reid, and J. A. Smerdon

  • Surface Science Research Centre, The University of Liverpool, Liverpool L69 3BX, United Kingdom

R. D. Diehl

  • Department of Physics, Pennsylvania State University, University Park, Pennsylvania 16802, USA

T. A. Lograsso and A. R. Ross

  • Ames Laboratory, Iowa State University, Ames, Iowa 50011, USA

R. McGrath*

  • Surface Science Research Centre and Department of Physics, The University of Liverpool, Liverpool L69 3BX, United Kingdom

  • *Corresponding author. Electronic address: mcgrath@liv.ac.uk

Article Text (Subscription Required)

Click to Expand

References (Subscription Required)

Click to Expand
Issue

Vol. 92, Iss. 13 — 2 April 2004

Reuse & Permissions
Access Options
Author publication services for translation and copyediting assistance advertisement

Authorization Required


×
×

Images

×

Sign up to receive regular email alerts from Physical Review Letters

Log In

Cancel
×

Search


Article Lookup

Paste a citation or DOI

Enter a citation
×