Study of Interfacial Point Defects by Ballistic Electron Emission Microscopy

T. Meyer and H. von Känel
Phys. Rev. Lett. 78, 3133 – Published 21 April 1997
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Abstract

Ballistic electron emission microscopy has been used to study individual point defects, which are located at the CoSi2/Si(111) interface of thin ( 30) silicide films grown epitaxially on silicon substrates by molecular beam epitaxy. Clear evidence for trapping of point defects at dislocations is presented. The lateral distribution of the interfacial point defects is explained in terms of diffusion during an annealing step in the growth process.

  • Received 2 December 1996

DOI:https://doi.org/10.1103/PhysRevLett.78.3133

©1997 American Physical Society

Authors & Affiliations

T. Meyer and H. von Känel

  • Laboratorium für Festkörperphysik, Eidgenössische Technische Hochschule Zürich-Hönggerberg, CH-8093 Zürich, Switzerland

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Vol. 78, Iss. 16 — 21 April 1997

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