Biying Song1, Zhiyuan Ding1, Christopher S. Allen2,3, Hidetaka Sawada4, Fucai Zhang5, Xiaoqing Pan6, Jamie Warner2, Angus I. Kirkland2,3, and Peng Wang1,*
- 1National Laboratory of Solid State Microstructures, College of Engineering and Applied Sciences and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, People’s Republic of China
- 2Department of Materials, University of Oxford, Parks Road, Oxford OX1 3PH, United Kingdom
- 3Electron Physical Sciences Imaging Centre, Diamond Lightsource Ltd., Didcot, Oxfordshire OX11 0DE, United Kingdom
- 4JEOL Ltd, 1-2 Musashino, 3-Chome, Akishima, Tokyo 196, Japan
- 5Department of Electrical and Electronic Engineering, Southern University of Science and Technology, Shenzhen 518055, People’s Republic of China
- 6Department of Chemical Engineering and Materials Science and Department of Physics and Astronomy, University of California, Irvine, California 92697, USA
- *Corresponding author.
wangpeng@nju.edu.cn