Intrinsic defect formation in amorphous SiO2 by electronic excitation: Bond dissociation versus Frenkel mechanisms

Koichi Kajihara, Masahiro Hirano, Linards Skuja, and Hideo Hosono
Phys. Rev. B 78, 094201 – Published 16 September 2008

Abstract

Two competing mechanisms of intrinsic defect formation in amorphous SiO2 (a-SiO2), i.e., the vacancy-interstitial (Frenkel) mechanism and Si-O bond dissociation to form silicon and oxygen dangling bonds, were compared under γ-ray electronic excitation. The Frenkel mechanism was found to be dominant. The concentrations of both kinds of defects strongly correlate with the degree of the structural disorder of a-SiO2, providing experimental evidence that both types of intrinsic defect pairs are formed mainly from the strained Si-O-Si bonds. The bond dissociation mechanism is more susceptible to the structural disorder than the vacancy-interstitial mechanism.

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  • Received 5 August 2008

DOI:https://doi.org/10.1103/PhysRevB.78.094201

©2008 American Physical Society

Authors & Affiliations

Koichi Kajihara1,2,*, Masahiro Hirano1, Linards Skuja1,3, and Hideo Hosono1,4

  • 1Transparent Electro-Active Materials Project, ERATO-SORST, Japan Science and Technology Agency, in Frontier Collaborative Research Center, Mail Box S2-13, Tokyo Institute of Technology, 4259 Nagatsuta, Midori-ku, Yokohama 226-8503, Japan
  • 2Department of Applied Chemistry, Graduate School of Urban Environmental Sciences, Tokyo Metropolitan University, 1-1 Minami-Osawa, Hachioji 192-0397, Japan
  • 3Institute of Solid State Physics, University of Latvia, Kengaraga iela 8, LV1063 Riga, Latvia
  • 4Materials and Structures Laboratory & Frontier Collaborative Research Center, Tokyo Institute of Technology, 4259 Nagatsuta, Midori-ku, Yokohama 226-8503, Japan

  • *Author to whom correspondence should be addressed. kkaji@tmu.ac.jp

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Issue

Vol. 78, Iss. 9 — 1 September 2008

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