Abstract
Two competing mechanisms of intrinsic defect formation in amorphous , i.e., the vacancy-interstitial (Frenkel) mechanism and Si-O bond dissociation to form silicon and oxygen dangling bonds, were compared under -ray electronic excitation. The Frenkel mechanism was found to be dominant. The concentrations of both kinds of defects strongly correlate with the degree of the structural disorder of , providing experimental evidence that both types of intrinsic defect pairs are formed mainly from the strained Si-O-Si bonds. The bond dissociation mechanism is more susceptible to the structural disorder than the vacancy-interstitial mechanism.
- Received 5 August 2008
DOI:https://doi.org/10.1103/PhysRevB.78.094201
©2008 American Physical Society