Void-induced cross slip of screw dislocations in fcc copper

Takahiro Hatano, Tetsuya Kaneko, Yousuke Abe, and Hideki Matsui
Phys. Rev. B 77, 064108 – Published 15 February 2008

Abstract

Pinning interaction between a screw dislocation and a void in fcc copper is investigated by means of molecular dynamics simulation. A screw dislocation bows out to undergo depinning on the original glide plane at low temperatures, where the behavior of the depinning stress is consistent with that obtained by a continuum model. If the temperature is higher than 300K, the motion of a screw dislocation is no longer restricted to a single glide plane due to cross slip on the void surface. Several depinning mechanisms that involve multiple glide planes are found. In particular, a depinning mechanism that produces an intrinsic prismatic loop is found. We show that these complex depinning mechanisms significantly increase the depinning stress.

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  • Received 14 May 2007

DOI:https://doi.org/10.1103/PhysRevB.77.064108

©2008 American Physical Society

Authors & Affiliations

Takahiro Hatano

  • Earthquake Research Institute, University of Tokyo, Tokyo 113-0032, Japan

Tetsuya Kaneko, Yousuke Abe, and Hideki Matsui

  • Institute for Materials Research, Tohoku University, Sendai 980-8577, Japan

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Issue

Vol. 77, Iss. 6 — 1 February 2008

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