Three-dimensional molecular dynamics simulations of void coalescence during dynamic fracture of ductile metals

E. T. Seppälä, J. Belak, and R. E. Rudd
Phys. Rev. B 71, 064112 – Published 28 February 2005

Abstract

Void coalescence and interaction in dynamic fracture of ductile metals have been investigated using three-dimensional strain-controlled multimillion atom molecular dynamics simulations of copper. The correlated growth of two voids during the coalescence process leading to fracture is investigated, both in terms of its onset and the ensuing dynamical interactions. Void interactions are quantified through the rate of reduction of the distance between the voids, through the correlated directional growth of the voids, and through correlated shape evolution of the voids. The critical intervoid ligament distance marking the onset of coalescence is shown to be approximately one void radius based on the quantification measurements used, independent of the initial separation distance between the voids and the strain rate of the expansion of the system. The interaction of the voids is not reflected in the volumetric asymptotic growth rate of the voids, as demonstrated here. Finally, the practice of using a single void and periodic boundary conditions to study coalescence is examined critically and shown to produce results markedly different than the coalescence of a pair of isolated voids.

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  • Received 7 September 2004

DOI:https://doi.org/10.1103/PhysRevB.71.064112

©2005 American Physical Society

Authors & Affiliations

E. T. Seppälä*, J. Belak, and R. E. Rudd

  • Lawrence Livermore National Laboratory, Condensed Matter Physics Division, L-045, Livermore, California 94551, USA

  • *Present address: Nokia Research Centre, P.O. Box 407, FIN-00045 NOKIA GROUP, Finland. Electronic address: eira@iki.fi
  • Electronic address: belak@llnl.gov
  • Corresponding author. Electronic address: robert.rudd@llnl.gov

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Issue

Vol. 71, Iss. 6 — 1 February 2005

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