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Strong dependence of the interlayer coupling on the hole mobility in antiferromagnetic La2xSrxCuO4 (x<0.02)

M. Hücker, H.-H. Klauss, and B. Büchner
Phys. Rev. B 70, 220507(R) – Published 29 December 2004

Abstract

We have studied the magnetic coupling between the CuO2 planes in the antiferromagnetic (AF) phase of Sr- and Zn-doped La2CuO4 by analyzing the spin-flip transition in the magnetization curves. We find that the interlayer coupling plays a key role in the suppression of the AF phase, and that only mobile holes cause a strong frustration of the interlayer coupling. Depending on the hole mobility, samples with identical Néel temperature can have a very different interlayer coupling.

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  • Received 12 August 2004

DOI:https://doi.org/10.1103/PhysRevB.70.220507

©2004 American Physical Society

Authors & Affiliations

M. Hücker1,4, H.-H. Klauss2, and B. Büchner3

  • 1Physics Department, Brookhaven National Laboratory, Upton, New York 11973, USA
  • 2Metallphysik und Nukleare Festkörperphysik, TU-Braunschweig, 38106 Braunschweig, Germany
  • 3Institut für Festkörper- und Werkstoffforschung Dresden, D-01171 Dresden, Germany
  • 4II. Physikalisches Institut, Universität zu Köln, 50937 Köln, Germany

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Vol. 70, Iss. 22 — 1 December 2004

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