Abstract
We have investigated the step stiffness on Cu(001) surfaces as a function of step orientation by two independent methods at several temperatures near 300 K. Both sets of data agree well and show a substantial dependence of the stiffness on the angle of orientation. With the exception of steps oriented along the experimental stiffness is significantly larger than the stiffness calculated within the solid-on-solid model and the Ising model, even if next-nearest-neighbor interactions are taken into account. Our results have considerable consequences for the understanding and for the theoretical modeling of equilibrium and growth phenomena, such as step meandering instabilities.
- Received 10 February 2003
DOI:https://doi.org/10.1103/PhysRevB.67.121410
©2003 American Physical Society